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product structure silicon monolithic integrated circuit this product is not designed for pr otection against radioactive rays . 1/14 tsz02201-0333aaz00350-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2015 rev.002 tsz22111 ? 14 ? 001 www.rohm.com free delay time setting cmos voltage detector ic BD4142HFV general description BD4142HFV is 1ch voltage detector ic for monitoring an input voltage line. the defaul t detected voltage is 0.5v and is adjustable via external resistors. when monitoring an input voltage supply, the ic outputs a high signal via a pgood pin when the supply rises above the threshold and is low when below. features ? open drain output ? built in under voltage lockout (uvlo) circuit ? delay time controlled by external capacitor ? very small and low height package ? pgood high output applications laptop pc, desktop pc, lcd-tv, printer, stb, digital appliances, and more. key specifications ? input voltage range: 3.0v to 5.5v ? detected voltage: 500mv(typ) ? pgood output on resistance: 100 ? (typ) ? bias current: 7.5 a (typ) ? operating temperat ure range (ta): -10 to +100 package hvsof5 1.60mm x 1.60mm x 0.60mm typical application circuit figure 1. typical application circuit hvsof5 v cc dly pgood gnd in v cc gnd r2 u1 BD4142HFV c ext r3 r1 pgood v mon c vcc 4 5 2 3 1 datashee t downloaded from: http:///
datasheet d a t a s h e e t 2/14 tsz02201-0333aaz00350-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD4142HFV pin configuration pin description pin no. symbol function 1 pgood reset output pin (power good signal) 2 gnd ground pin 3 v cc power supply input pin 4 in monitoring voltage input pin 5 dly capacitor connected pin for setting delay time bottom e-pad substrate. connect the substrate to gnd. block diagram figure 3. block diagram figure 2. pin configuration (top view) 5 1 2 3 4 pgood gnd v cc dly in pgood uvlo 0.5v v cc in dly 1 5 3 2 gnd 4 r2r3 c ext r1 v cc delay downloaded from: http:///
datasheet d a t a s h e e t 3/14 tsz02201-0333aaz00350-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD4142HFV absolute maximum ratings (ta=25 ) parameter symbol limits unit terminal voltage v cc , v in , v dly , v pgood 6 *1 v power dissipation pd 0.67 *2 w pgood capacity current i pgood 5 ma operating temperature r ange topr -10 to +100 storage temperature range tstg -55 to +150 junction temperature tjmax +150 *1 no need to exceed pd. *2 reduced by ja = 186.6 /w when used over 25 . (when mounted on a board 70.0mm 70mm 1.6mm glass-epoxy pcb which has 1 layer. (copper foil density :2%)) recommended operating ratings (ta=25 ) parameter symbol limits unit min max terminal voltage v cc 3.0 5.5 v v in -0.3 v cc - 2 v v pgood -0.3 5.5 v v dly -0.3 v cc v electrical characteristics (unless otherwise noted, ta=25 , v cc =5v) parameter symbol limits unit conditions min typ max bias current i cc - 7.5 20 a detected voltage v det 491 500 509 mv in sweep up hysteresis voltage v hys - 10 - mv in sweep down delay current i dly 150 250 350 na in=0.6v pgood output on resistance r out - 100 200 ? in=0v pgood output leak current i out - 0 5 a in=0.6v downloaded from: http:///
datasheet d a t a s h e e t 4/14 tsz02201-0333aaz00350-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD4142HFV typical performance curves (unless otherwise noted, ta=25 , v cc =5v) figure 4. supply voltage - bias current figure 5. temperature - bias current figure 6. supply voltage - detected volta ge figure 7. temperature - detected voltage 0 1 2 3 4 5 6 7 8 9 10 0123456 supply voltage : v cc [v] bias current : i cc [a] 0 2 4 6 8 10 12 - 1 01 03 05 07 09 0 temperature : ta[ ] bias current : i cc [a] 450 460 470 480 490 500 510 520 530 540 550 33 . 544 . 555 . 5 supply voltage : v cc [v] detected voltage : v det [mv] 450 460 470 480 490 500 510 520 530 540 550 - 1 01 03 05 07 09 0 temperature : ta[ ] detected voltage : v det [mv] downloaded from: http:///
datasheet d a t a s h e e t 5/14 tsz02201-0333aaz00350-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD4142HFV typical performance curves (unless otherwise noted, ta=25 , v cc =5v) - continued figure 8. supply voltage - delay current figure 9. temperature - delay current 200 210 220 230 240 250 260 270 280 290 300 33 . 544 . 555 . 5 supply voltage : v cc [v] delay current : i dly [na] 200 220 240 260 280 300 320 - 1 01 03 05 07 09 0 temperature : ta[ ] delay current : i dly [na] 0 5 10 15 20 25 0 2000 4000 6000 8000 10000 external capacitance : c ext [pf] delay time : t delay [ms] figure 10. external capacitance - delay time downloaded from: http:///
datasheet d a t a s h e e t 6/14 tsz02201-0333aaz00350-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD4142HFV basic operation BD4142HFV is a 1ch voltage detector ic with an independent supply voltage (v cc ). v cc voltage must be supplied before inputting the monitoring voltage (in). timing chart figure 11. input-output voltage characteristic t delay in [v] 0 0.5 dly [v] pgood [v] 0.5 t t t hys=10mv(typ) figure 12. timing chart (v cc =5v) 0 5 0.5 in [v] pgood [v] (example) when using a 4700pf capacitor, (example) when setting a 2ms delay, t delay is calculated as below. detected delay time (t delay ) setting [na] = = [s] = dela y t [f] ext c [mv] ext c [f] ? [f] ext c dela y t / ) ( ? [s] = = dela y t [pf] ? ? [ms] \ 9 ? = 9. = = = = / ext c [ms] ) ( ? ? \ ? \ 9 ? [pf] downloaded from: http:///
datasheet d a t a s h e e t 7/14 tsz02201-0333aaz00350-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD4142HFV limit of detected delay time operation (ta=25 , v cc =5v, c ext =4700pf) when the input pulse width (i n) is shorter than 50s (typ) (20s (min)), pgood goes low and come back to high without any delay time setup by capacitor of dly terminal. the behavior depends on the v cc voltage and the c ext capacitance. limit of reaction time if the input pulse (in) is shorter than 1s (t yp), pgood does not react (pgood keeps high). figure 13. input low pulse is shorter than 50s (typ) (ta=25 , v cc =5v, c ext =4700pf) in [v] t t pgood [v] 1s (typ) figure 14. input low pulse is shorter than 1s in [v] t t pgood [v] 50s (typ) no delay inserted downloaded from: http:///
datasheet d a t a s h e e t 8/14 tsz02201-0333aaz00350-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD4142HFV v cc operation when v cc is below the minimum operation vo ltage, pgood pin will become high. (the meaning of the minimum operation voltage is : when the starting of v cc , pgood output voltage become within 10% of v cc voltage, and the value will be around 0.8v (typ ). note that this value is reference.) when v cc value exceeds the minimum operation volta ge, pgood output become low until the v cc reached uvlo released voltage (2.5v (typ)). when v cc exceeds uvlo released voltage, pgood pin will become high if the input voltage of in pin is over the detected voltage (0.5v (typ)), and pgood pin will become low if the input voltage of in pin is below the detected voltage. figure 15. in > detected voltage v cc [v] 0 pgood [v] t t 5 0.8 t in [v] detected voltage (0.5v typ) in figure 17. in < detected voltage figure 16. v cc operation t v cc [v] 0 0.8 pgood [v] uvlo release voltage t 2.5 5 t in [v] detected voltage (0.5v typ) in r pgood v cc pgood dly v cc gnd in downloaded from: http:///
datasheet d a t a s h e e t 9/14 tsz02201-0333aaz00350-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD4142HFV application example figure 18. application circuit table 1. recommended component values ref des value description type manufacturer u1 - BD4142HFV - rohm c1 - - - - c2 4700pf grm18 series, 50v, 1608 ceramic capacitor murata c3 - - - - c4 0.01f grm18 series, 50v, 1608 ceramic capacitor murata r1 100k ? mcr03 series, 1608 chip resistor rohm r2 short - - - r3 - - - - r4 short - - - ? r1 (pull-up resistor) r1 should be set not to be affected by output l eak current (5a (max)) and capacity current (5ma). ? r2, r3 the detected voltage is adjustable via external resistors (r2, r3). the recommended total resistance value for r2 and r3 is within total 300k ? . ? c2 (capacitor for dete cted delay time setting) please set c2 value with double of minimum delay time for application. please refer to page. 6 regarding detected delay time setting. the maximum value of c2 is 4.7f. v cc dly pgood gnd in v cc gnd r2 u1 BD4142HFV c1 (capacitor for noise filtering) c2 r3 c3 (capacitor for noise filtering) r1 pgood v mon c4 r4 4 5 2 3 1 downloaded from: http:///
datasheet d a t a s h e e t 10/14 tsz02201-0333aaz00350-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD4142HFV power dissipation hvsof5 i/o equivalence circuit 1. pgood 4. in 5. dly pcb size 70mm 70mm 1.6mm board 1 layer board copper foil density : 2% 0 25 50 75 100 125 150 0.4 1 0.67w ambient temperature [ ] power dissipation [w] 0.2 0.6 0.8 downloaded from: http:///
datasheet d a t a s h e e t 11/14 tsz02201-0333aaz00350-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD4142HFV operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can dam age the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance suppl y lines. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capa citance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluct uations in the small-signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the ch ip. in case of exceeding this absolut e maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that t he internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and del ays, especially if the ic has more than one power supply. therefore, give special consid eration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capaci tor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removi ng it from the test setup duri ng the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when m ounting the ic on the pcb. inco rrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input pins input pins of an ic are oft en connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric fi eld from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spec ified, unused input pins shoul d be connected to the power supply or ground line. downloaded from: http:///
datasheet d a t a s h e e t 12/14 tsz02201-0333aaz00350-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD4142HFV operational notes C continued 12. regarding the input pin of the ic this monolithic ic contains p+ isolati on and p substrate layers between adjacent el ements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers wi th the n layers of other elem ents, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in t he structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure 19. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. ordering information b d 4 1 4 2 h f v t r part number package hfv: hvsof5 packaging and forming specification tr: embossed tape and reel marking diagram hvsof5 (top view) aq part number marking lot number downloaded from: http:///
datasheet d a t a s h e e t 13/14 tsz02201-0333aaz00350-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD4142HFV physical dimension, tape and reel information package name hvsof5 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin downloaded from: http:///
datasheet d a t a s h e e t 14/14 tsz02201-0333aaz00350-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD4142HFV revision history date revision changes 29. jan. 2013. 001 new release 21. aug. 2015 002 add application example downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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